Main 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems

Name: 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems
Rating: 5.0 (4 reviews)
ISBN: 9781424402755

Llobera, A.; Cadarso, V.J.; Seidemann, V.; Buttgenbach, S.; Plaza, J.A.

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Categories:

Year:

2022

Publisher:

IEEE

Language:

English

ISBN 10:

1424402751

ISBN 13:

9781424402755