Main Arbitrary Modeling of TSVs for 3D Integrated Circuits
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Arbitrary Modeling of TSVs for 3D Integrated Circuits

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.


Request Code : ZLIBIO1291784
Categories:
Year:
2015
Edition:
1
Publisher:
Springer International Publishing
Language:
English
Pages:
179
ISBN:
978-3-319-07610-2,978-3-319-07611-9
Series:
Analog Circuits and Signal Processing
This book is not available due to the complaint of the copyright holder.

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