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Wafer Bonding: Applications and Technology

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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.


Request Code : ZLIBIO941212
Categories:
Year:
2004
Edition:
1
Publisher:
Springer-Verlag Berlin Heidelberg
Language:
English
Pages:
504
ISBN:
978-3-642-05915-5,978-3-662-10827-7
Series:
Springer Series in MATERIALS SCIENCE 75
This book is not available due to the complaint of the copyright holder.

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